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Vacuum Reflow Oven Soldering Machine

Vacuum Reflow Oven Soldering Machine

Mobel:  1150D
● MOQ :  1 set
● Packing details:  
● Subject to discussion:

Key Features

Key Feature Description
Vacuum Soldering Environment Performs reflow soldering under vacuum (as low as 2 mbar), effectively eliminating voids, air inclusions, and oxidation — delivering defect-free, high-reliability solder joints critical for automotive, aerospace, and medical electronics.
Three-Stage Transport System Independent heating zone, vacuum zone, and cooling zone allow individually adjustable process control for each stage — ensuring optimal thermal profile, void reduction, and safe board cooling in a single continuous pass.
Automatic Furnace Lid Opening Motorized automatic lid opening system on the vacuum chamber facilitates quick, safe access for cleaning, maintenance, and changeover — minimizing downtime and improving operational efficiency.
5 HP Water Cooling System Equipped with a high-performance 5 HP water cooler for the cooling zone, ensuring rapid and uniform heat dissipation from PCBs after soldering to prevent thermal stress and component damage.
Efficient Flux Recovery System Integrated flux recovery and management system prevents rosin residue buildup inside the chamber — reducing cleaning frequency and maintaining process cleanliness.
Fast Production Cycle Average production cycle of 40–60 seconds per board enables high-throughput continuous production, meeting the demands of both small-batch and large-volume SMT lines.
PLC + PC Control System Dual-architecture control (PLC + computer interface) with vacuum profile editing capability, real-time monitoring, and data logging for full traceability and process repeatability.
Lead-Free & RoHS Compliant Fully supports lead-free (SAC alloy) soldering processes in compliance with RoHS and international environmental standards, as well as traditional Sn-Pb processes where required.

Technical Specifications

Specification Details
Voltage 380 V
Type Automatic Solders (Vacuum Reflow)
Condition New
Warranty 1 Year
Rated Capacity 1000 W
Current 100 A
Place of Origin Guangdong, China
Brand Name Jaguar
Machine Dimensions 6600 × 1670 × 1570 mm
Machine Weight 4300 kg
Vacuum Degree 1 ~ 10 mbar
Belt Width 500 mm
Heating Time 45 minutes
Transport Speed 300 – 2,000 mm/min
Heating Zones UP 10 / BOTTOM 10 (20 zones total)
Heating Zone Length 3,500 mm
Transport System Three-stage: Heating Zone → Vacuum Zone → Cooling Zone
Production Cycle 40 – 60 seconds (average)
Cooling System 5 HP Water Cooler
Control System PLC + PC / Touch Screen
Solder Type Lead-Free (SAC) / Sn-Pb
Certification CE, ISO 9000, RoHS

Packaging & Delivery

Parameter Details
Selling Units Single item
Single Package Size 7360 × 1870 × 1660 cm
Single Gross Weight 4600.000 kg
Packaging Type Vacuum package and plywood case

Applications

  • High-reliability SMT PCB assembly requiring void-free solder joints (BGA, QFN, LGA packages)
  • Automotive ECU, power module, LED lighting, and EV battery management system PCB soldering
  • Aerospace and defense electronics requiring MIL-spec solder joint integrity
  • Medical device PCB assemblies where joint reliability is safety-critical
  • Power electronics: IGBT modules, DC-DC converters, power supply assemblies
  • Telecommunications and 5G infrastructure equipment PCB production
  • Industrial automation control boards, relay modules, and sensor assemblies
  • Consumer electronics, smart devices, and IoT hardware manufacturing

Industries Served

  • Consumer electronics and smart device manufacturing
  • Automotive electronics (ECUs, ADAS modules, LED lighting, EV battery systems)
  • Aerospace & defense high-reliability PCB assemblies
  • Medical devices and life sciences electronics
  • Industrial automation, power electronics, and control systems
  • Telecommunications, networking, and 5G infrastructure
  • LED lighting and display panel production
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