12 Zones Lead-free Hot Air Reflow Oven F12
12 Zones Lead-free Hot Air Reflow Oven F12
● Mobel: 1150D
● MOQ : 1 set
● Packing details:
● Subject to discussion:
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Key Features
| Key Feature | Description |
| 12-Zone Heating System (24 Elements) | 12 independent heating zones with 24 elements (UP 12 / BOTTOM 12), each with individual temperature and switch control. Provides the precise thermal profiling required for complex BGAs, QFNs, and mixed-component assemblies. |
| New Energy-Saving Furnace Design | 4-sided return air circulation design ensures optimal hot air convection, best-in-class temperature uniformity (±1~2°C), and faster thermal compensation — reducing energy consumption during continuous production. |
| Plug-In High-Temperature Motors | Imported plug-in type high-temperature motors allow quick replacement in under 5 minutes, minimizing maintenance downtime and ensuring continuous production reliability. |
| Siemens PLC + IPC Control System | Dual-architecture control: Siemens PLC for real-time machine performance, combined with a professional Industrial PC (IPC) running Windows 7. If IPC crashes, PLC continues offline — production is never interrupted. |
| Mesh & Chain Conveyor System | Precision mesh and chain transmission controlled by computer for smooth, shake-free PCB transport. Stepless frequency converter speed control (0.35–1.5 m/min), accuracy ±2 mm/min. Rail width adjustable 50–400 mm. |
| Forced Air Dual Cooling Zones | 2 independent cooling zones (UP 2 / BOTTOM 2) with axial fan forced air cooling ensure rapid, uniform heat dissipation from boards after reflow — preventing component thermal stress and deformation. |
| Automatic Cylinder Body Lifting | The furnace body lifts automatically via cylinder for safe, convenient access to the internal heating chamber for inspection, cleaning, and maintenance. |
| UPS & Auto Delay Shutdown | Built-in UPS and automatic delay shutdown system protect PCBs and the machine in the event of power failure or overheat — preventing component damage and ensuring safe shutdowns. |
| Nitrogen Option Available | Optional nitrogen atmosphere module for oxide-free, void-minimized soldering — suitable for high-reliability applications requiring inert atmosphere reflow. |
| Comprehensive Alarm System | Multi-mode alarms: abnormal temperature (extra-high / extra-low), board-dropped alarm, and 3-color tower light (Yellow = Warning, Green = Normal, Red = Abnormal) for clear operator visibility. |
Technical Specifications
| Specification | Details |
| Model | JAGUAR F12 |
| Machine Type | Lead-Free Hot Air Reflow Oven |
| Heating Zones | UP 12 / BOTTOM 12 (24 elements total) |
| Heating Zone Length | 4,640 mm |
| Heating Mode | Hot Air (Forced Circulation) |
| Cooling Zones | UP 2 / BOTTOM 2 |
| Cooling Mode | Forced Air Cooling |
| Exhaust Volume | 10 m³/min × 2 exhausts |
| Max. PCB Width | 400 mm |
| Mesh Belt Width | 450 mm |
| Rail Width Range | 50 – 400 mm |
| Conveyor Speed | 0 – 2,000 mm/min (0.35 – 1.5 m/min) |
| Speed Accuracy | ±2 mm/min |
| Conveyor Direction | Left to Right (Right to Left optional) |
| Conveyor Height | 900 ± 20 mm |
| Transmission Type | Mesh belt and chain |
| Component Clearance | Top and bottom 25 mm |
| Power Supply | 5-line, 3-phase 380V 50/60 Hz |
| Total Power | 56 kW |
| Starting Power | 48 kW |
| Normal Power Consumption | 12 kW |
| Warm-up Time | ~20 minutes |
| Temp. Setting Range | Room temperature to 300°C |
| Temp. Control Method | PID closed-loop control & SSR driving |
| Temp. Control Precision | ±1°C |
| Temp. Deviation on PCB | ±2°C |
| Control System | Siemens PLC + Professional IPC |
| OS / Interface | Windows 7; Chinese & English bilingual |
| Data Storage | Process data and status storage (80 GB) |
| Nozzle Plate | Aluminum Alloy |
| Machine Dimensions (L×W×H) | ~6,600 × 1,420 × 1,580 mm |
| Machine Weight | ~2,000 kg |
| Color | Computer Gray |
| Condition | New |
| Nitrogen Option | Available (optional) |
| Certification | CE, CCC, ISO 9000, RoHS |
| Warranty | 12 Months |
| Place of Origin | Shenzhen, Guangdong, China |
Applications
- High-volume SMT PCB assembly lines requiring precise, repeatable thermal profiling
- Lead-free soldering of BGA, QFN, LGA, and fine-pitch surface-mount components
- Mixed-technology PCB assembly (SMT + THT) with complex thermal requirements
- Automotive electronics: ECUs, ADAS modules, LED lighting, and EV battery management PCBs
- Aerospace and defense high-reliability PCB assemblies
- Medical device PCBs requiring strict temperature control and process traceability
- Industrial automation control boards, power electronics, and relay module assemblies
- Telecommunications, networking, and 5G infrastructure PCB production
- LED driver boards, display panels, and consumer electronics manufacturing
Industries Served
- Consumer electronics and smart device manufacturing
- Automotive electronics (ECUs, ADAS, EV battery systems, LED lighting)
- Aerospace & defense high-reliability PCB assemblies
- Medical devices and life sciences electronics
- Industrial automation, power electronics, and control systems
- Telecommunications, networking, and 5G infrastructure
- LED lighting and display panel production
