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Solder Paste Inspection Machine

Solder Paste Inspection Machine

Mobel:  1150D
● MOQ :  1 set
● Packing details:  
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Product overview   

         The Solder Paste Inspection (SPI) Machine is an advanced inline inspection solution designed to ensure high-quality solder paste printing in SMT production. By capturing precise 3D images and analyzing solder paste volume, height, area, and shape, the system helps manufacturers detect and correct printing defects early in the process — before component placement.

          With its professional optical design, powerful data processing, and intelligent software algorithms, this SPI system provides fast, accurate, and reliable inspection results for both high-mix and high-volume manufacturing environments.

Technical specifications

Specification Detail
PCB Size 55 × 55 ~ 460 × 460 mm
PCB Thickness 0.5 ~ 7.0 mm
PCB Weight ≤ 5.0 kg
Conveyor Adjustment Manual/automatic
Measure Type Height, Area, Volume, Offset, Bridge, Shape (missing print, insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination)
Paste Height 0 ~ 550 µm
Min Pad Pitch ≥ 100 µm
Measure Principle 3D white light PSLM PMP (Programmable Spatial Light Modulation, Phase Measurement Profilometry)
Inspection Head Quantity 1
Camera Pixel 5M (10M/12M as option)
Detection Speed 0.35 ~ 0.5 s/FOV
Program Time 5 ~ 10 min
Data Type Gerber Data 274D/274X, Scan PCB
Power AC220V, 50/60 Hz, 1 KVA
Machine Dimension 1000 × 1150 × 1530 mm
Weight 965 kg

 

Applications

The SPI machine is ideal for solder paste quality control in SMT assembly lines across a wide range of industries, including:

  • Consumer electronics
  • Automotive electronics
  • Industrial control systems
  • Communication equipment
  • Medical and aerospace electronics

It supports various PCB types — from fine-pitch boards and BGA layouts to ultra-thin and flexible substrates — ensuring comprehensive process quality assurance.

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