R-400M Sereis Modules Router
R-400M Sereis Modules Router
● Mobel: 1150D
● MOQ : 1 set
● Packing details:
● Subject to discussion:
Couldn't load pickup availability
Key Features
- High-Power 400W Plasma: 400W plasma power output for stronger surface activation and deeper contamination removal than entry-level models.
- Wide PCB Compatibility: Supports PCB widths up to 500mm — ideal for large-format boards used in automotive and industrial electronics.
- Atmospheric Pressure Operation: No vacuum chamber needed; runs at atmospheric pressure for true inline, continuous throughput.
- Dry Chemical-Free Process: Eliminates organic residues, oxides, moisture films, and particulates without any liquid chemicals.
- Surface Activation & Adhesion: Dramatically increases surface energy for superior solder paste wetting, coating adhesion, and underfill flow.
- PLC Touchscreen Control: PLC touchscreen control with programmable multi-recipe management for different board types and processes.
- Flexible Process Setup: Motorized or manual conveyor width adjustment with adjustable plasma head height for process flexibility.
- Dual ESD Protection: Anti-static ionizer bars at entry and exit protect ESD-sensitive components throughout transport.
- SMEMA Line Integration: SMEMA-compatible for automatic start/stop integration with upstream and downstream SMT equipment.
- Eco-Friendly & Compliant: Zero chemicals consumed; zero hazardous waste generated. Fully RoHS and CE compliant.
Technical Specifications
| Specification | Details |
| Model | VC400 |
| Plasma Type | Atmospheric Pressure Plasma (APP) |
| Input Voltage | 220V AC / 50~60Hz |
| Power Consumption | ≤ 2000W |
| Plasma Power Output | 400W (adjustable) |
| Plasma Frequency | 20~40 kHz |
| PCB Board Width | 50 ~ 500 mm (adjustable) |
| PCB Board Thickness | 0.4 ~ 5.0 mm |
| Conveyor Speed | 0.3 ~ 3.0 m/min (adjustable) |
| Flow Direction | Left to Right / Right to Left (configurable) |
| Conveyor Height | 900 ± 20 mm (standard SMT height) |
| Treatment Gap | 5 ~ 20 mm (plasma head to board surface) |
| Machine Dimensions | ~L1000 × W900 × H1400 mm (contact for exact) |
| Machine Weight | Approx. 180 kg (contact for exact) |
| Operating Temperature | 15°C ~ 35°C |
| Operating Humidity | 20% ~ 80% RH (non-condensing) |
| Control System | PLC + Touchscreen HMI (multi-recipe) |
| Communication | SMEMA / RS-232 / optional Ethernet |
| Certification | CE |
* Specifications may vary. Please contact Vectron-Tech for the latest confirmed datasheet.
Applications
The VC400 Inline Plasma Cleaner is suited for demanding production processes including:
- PCB surface cleaning before solder paste printing (SPI pre-treatment)
- Surface activation before underfill dispensing and flip-chip encapsulation
- Pre-treatment before conformal coating to maximize adhesion and coverage
- Oxide and contamination removal before SMT component placement
- Pre-cleaning before wire bonding, BGA rework, and advanced packaging
- Large-format LED and display panel substrate surface activation
- Automotive ECU, ADAS sensor module, and power electronics PCB manufacturing
- Medical device and aerospace PCB assembly lines requiring stringent cleanliness standards
Industries Served
- Consumer electronics and smart device manufacturing
- Automotive electronics (ECUs, ADAS modules, LED lighting, EV battery management)
- Aerospace & defense high-reliability PCB assemblies
- Medical devices and life sciences electronics
- Industrial automation and power electronics
- Telecommunications and 5G infrastructure PCBs
- LED lighting and display panel production
Why Choose the VC400?
|
vs. VC350 (Entry Model)
50% more plasma power (400W vs 350W) and wider board support (500mm vs 450mm) for higher throughput and more demanding processes. |
vs. Solvent / Wet Cleaning
No chemicals, no drying step, no waste disposal. Safer for operators; lower total cost of ownership. |
|
vs. Vacuum Plasma Systems
No batch processing. Continuous inline flow with no pump-down time — dramatically higher throughput per hour. |
vs. UV / Corona Treatment
More uniform activation energy; effective on complex geometries, vias, and recessed areas UV cannot reach. |
