Plasma Surface Treatment Machine AP100
Plasma Surface Treatment Machine AP100
● Mobel: 1150D
● MOQ : 1 set
● Packing details:
● Subject to discussion:
Couldn't load pickup availability
Technical specifications
| Item | Specification |
|---|---|
| Equipment Size | 576 mm (L) × 232 mm (W) × 373 mm (H) |
| Weight | 20 kg |
| Input Power Supply | AC 220V, 50/60Hz |
| Rated Power | 500 W |
| High Voltage Frequency | 40 kHz |
| Working Gas | Anhydrous, oil-free compressed air (optional nitrogen or other gases) |
| Protection Functions | Overload protection, short-circuit protection, open-circuit protection, temperature protection |
| Control Options | Local control & remote control available |
| Spray Gun Types | Rotary spray gun / Direct injection spray gun |
| Rotary Gun Options | Treatment width & diameter: Ø80 mm, Ø60 mm, Ø40 mm, Ø20 mm (optional) |
| Direct Injection Options | Treatment width & diameter: 2 mm, 3 mm, 5 mm |
| Cable Length | 3 m (customizable) |
| Warranty & Service | Standard manufacturer warranty; extended service available upon request |
| Support |
Detailed instruction manual and engineering support provided |
Applications
The AP-100 Plasma Cleaner is widely used for surface activation, cleaning, coating preparation, and bonding enhancement across multiple industries.
Industrial Applications Include:
(a) Electronics & Semiconductor
PCB surface cleaning and activation before coating or adhesive application.
LCD display coating and screen printing preparation.
Removal of oils, dust, and glue residues from casings and connectors.
(b) Automotive
Pre-bonding treatment for headlamp housings, brake pads, and sealing strips.
Surface activation before painting or adhesive sealing.
(c) Medical Devices
Pre-treatment of needles, plastic catheters, and tubing before bonding or coating.
(d) Machinery & Metal Processing
Fine cleaning of metal parts before plating or sealing.
Non-destructive surface activation for precision components.
(e) Packaging & Printing
Plasma pre-treatment on cartons, films, and packaging materials to improve adhesion and ink bonding.
