● Mobel: 1150D ● MOQ : 1 set ● Packing details: ● Subject to discussion:
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Key Features
Key Feature
Description
Automatic Conveying Power System
Fully automated conveying with auto synchronous board feeding functions, ensuring smooth and consistent PCB flow through the machine without manual intervention.
Japanese Scanning Spray Flux System
Transverse scanning spray nozzle system using premium Japanese nozzles with rodless pneumatic cylinder and PLC control — delivering precise, even flux application every cycle.
IR Ceramic Preheating (1 Zone)
Remote infrared ceramic heating pipe preheating system provides efficient, direct heat radiation to the PCB bottom — fast ramp-up to 150°C in ~10–15 minutes and thorough flux activation.
Frequency-Converter Wave Crest Drive
Solder pot peak uses imported high-frequency conversion motor with independent control and stepless frequency converter speed adjustment — precise, independent wave height control for consistent solder joints.
Titanium Alloy Solder Pot
Solder pot constructed from titanium alloy for superior resistance to tin corrosion and adhesion — extended pot lifespan, lower maintenance costs, and cleaner solder quality vs. standard cast iron.
Special Alloy Conveyor Fingers
Non-stick tin, reinforced double V-groove special alloy chain claw fingers ensure reliable PCB transport and clean solder joint quality with minimal contamination risk.
PID + SSR Temperature Control
PID closed-loop temperature control combined with SSR (Solid State Relay) driving for the solder pot — precise, stable temperature maintenance up to 300°C with ±1°C accuracy.
PLC Control System
PLC-based control with press-key operation as standard; optional touch screen or full PC control upgrade available for enhanced process parameter management and data traceability.
UPS & Fault Alarm System
Built-in fault diagnosis and audible/visual alarm system with automatic delay shutdown protection — prevents PCB and machine damage during abnormal conditions or power interruptions.
Lead-Free & Sn-Pb Compatible
Supports both lead-free (SAC alloy) and traditional Sn-Pb soldering processes with an independently designed, easy-to-clean solder furnace compliant with RoHS requirements.
Technical Specifications
Specification
Details
Model
JAGUAR N200
Machine Type
Manual Mini Wave Soldering Machine (Lead-Free / Sn-Pb)
Condition
New
Warranty
12 Months
Preheating Zones
1 zone
Preheating Zone Length
450 mm
Preheating Method
IR Infrared Ceramic (standard); Hot Air optional
Preheating Power
220V / 5 kW
Preheating Time
~10–15 min to reach 150°C
Temp. Setting Range
Room temperature to 300°C
Solder Type
Lead-Free (SAC) / Sn-Pb
Solder Pot Capacity
180 kg
Solder Pot Material
Titanium Alloy
Solder Pot Temperature
Up to 300°C
Solder Power
380V / 6 kW
Solder Temp. Control
PID + SSR dual control
Wave Crest Drive Power
220V / 500 W
Solder Warm-up Time
~120 min to reach 250°C
PCB Width
50 – 250 mm
Conveyor Speed
300 – 1,800 mm/min
Conveyor Direction
Left to Right (Right to Left optional)
Conveyor Angle
4 – 7°
Component Lead Clearance
Within 10 mm
Flux System
Japanese scanning spray nozzle, rodless pneumatic cylinder, PLC controlled
Flux Pressure
3 – 5 bar
Flux Tank Capacity
3.2 L
Power Supply
3-phase 380V / 50–60 Hz
Total Power
9 kW
Running Power
3 – 5 kW
Air Supply
0.5 MPa
Control Method
Press Key + PLC (Touch Screen / PC optional)
Body Dimensions (L×W×H)
1,400 × 1,200 × 1,600 mm
Overall Dimensions (L×W×H)
2,100 × 1,200 × 1,600 mm
Machine Weight
500 kg
Certification
CE, CCC, ISO 9000, RoHS
Place of Origin
Shenzhen, Guangdong, China
Model Comparison: N200 vs. N250
Parameter
N200 (This Model)
N250 (Upgraded)
PCB Width
50 – 250 mm
50 – 300 mm
Solder Pot Capacity
180 kg
220 kg
Preheating Zones
1 zone / 450 mm
2 zones / 800 mm
Overall Dimensions
2,100 × 1,200 × 1,600 mm
2,600 × 1,200 × 1,600 mm
Machine Weight
500 kg
700 kg
Best For
Compact lines, smaller PCBs, AI/prototype runs
Mid-volume DIP lines, wider boards
Applications
Through-hole (DIP) component soldering for small-to-medium volume PCB assembly lines
AI PCB processing and prototype/R&D board soldering requiring compact, flexible equipment
Manual and semi-automated PCB soldering in space-constrained production environments
Consumer electronics: IoT modules, smart home devices, remote controls, LED driver boards
Industrial control boards, sensor modules, relay assemblies, and power supply PCBs
Automotive electronics: small ECU boards, sensor PCBs, and lighting module assemblies
Telecommunications and networking equipment PCB through-hole soldering
Educational, training, and low-volume contract manufacturing (EMS/PCBA services)
Industries Served
Consumer electronics and smart device manufacturing
Automotive electronics (sensors, ECUs, LED modules)
Industrial automation and control system manufacturing
AI hardware, IoT, and embedded systems prototyping
Telecommunications and networking equipment
Medical device PCB assembly (low-volume, high-reliability)
