• Hot Sales High-End Lead-Free Hot Air Reflow Oven Brand R8 JIT INDUSTRIAL ASIA
  • Hot Sales High-End Lead-Free Hot Air Reflow Oven Brand R8 JIT INDUSTRIAL ASIA
  • Hot Sales High-End Lead-Free Hot Air Reflow Oven Brand R8 JIT INDUSTRIAL ASIA
  • Hot Sales High-End Lead-Free Hot Air Reflow Oven Brand R8 JIT INDUSTRIAL ASIA
  • Hot Sales High-End Lead-Free Hot Air Reflow Oven Brand R8 JIT INDUSTRIAL ASIA

Hot Sales High-End Lead-Free Hot Air Reflow Oven Brand R8

Hot Sales High-End Lead-Free Hot Air Reflow Oven Brand R8

● Mobel:  1150D
● MOQ :  1 set
● Packing details:  
● Subject to discussion:

Key Features

Key Features  
8+8 Zone Heating Architecture: 16 independent heating zones (8 top / 8 bottom) with patented air management structure — delivers more efficient hot air convection and faster thermal compensation across the entire PCB.
PLC + PID Closed-Loop Control: Dual-layer control via PLC and modular circuit with PID closed-loop temperature regulation, achieving industry-leading precision of ±1°C across all zones simultaneously.
Intelligent Diagnostic System (IDS): Built-in IDS provides real-time trouble reminders, fault alerts, error list-out, and SPC data recording — minimizing downtime and enabling full process traceability.
Win7 Bilingual Interface: Windows 7 platform with user-friendly GUI; easily swap between English and Chinese. Powerful software saves all settings, supports data printout and 80 GB process data storage.
Independent Zone & Blower Control: Zone temperature and blower speed are controlled independently per zone — enabling precise profile management for diverse PCB types including BGA, CSP, and 0201 components.
Water Chiller Cooling System: Forced-air cooling system with water chiller integration ensures rapid, stable thermal descent after the reflow peak — ideal for lead-free SAC alloy profiles.
Nitrogen Atmosphere Option: Optional N2 module with O2 analyzer enables oxide-free soldering environment, dramatically reducing solder bridging and improving joint quality on fine-pitch and high-density boards.
Hardened Rail Track System: Rail tracks treated with hardening process for superior wear resistance. Auto-lubrication as standard; optional SPG gear motor for automatic conveyor width adjustment.
Flux Removal Unit: Integrated flux collection and removal unit meets environmental protection requirements and prevents flux contamination of heating elements for extended machine lifespan.
SMEMA / Inline Compatible: Conveyor direction L→R (or R→L) with 900±20 mm standard SMT line height; mesh and chain conveyor system for reliable, smooth PCB transport across all board types.

Technical Specifications

Specification Details
HEATING SYSTEM
Model JAGUAR R8 / R8-N (Nitrogen variant)
Heating Zones Top 8 / Bottom 8 (16 independent zones)
Cooling Zones Top 3 / Bottom 3
Heating Passage Length 3,121 mm
Heating Style Hot Air (forced convection)
Cooling Style Water Chiller
Exhaust Volume 10 m³/min × 2 exhaust ports
CONVEYOR SYSTEM
Max. PCB Width 420 mm (Alibaba spec) / 460 mm (R8-N spec)
Mesh Belt Width 500 mm
Conveyor Direction L → R (R → L optional)
Process Height 900 ± 20 mm (standard SMT height)
Conveyor Type Mesh and Chain
Conveyor Speed 300 ~ 2,000 mm/min (adjustable)
Auto Lubrication Standard
Fixed Track Front Rail Fixed (optional: Rear Rail Fixed)
Product Clearance Top and Bottom 25 mm
CONTROL SYSTEM
Power Supply 380V AC / 50~60Hz, 5-cable 3-phase
Total Power Consumption ≤ 40 kW (Rated); ~1,000 W startup draw
Startup Consumption 60 kW / 33 kW (peak)
Steady-State Consumption 6 ~ 9 kW (during production)
Ramp-Up Time ~20 minutes
Temp. Set-Point Range Room temperature ~ 300°C
Temp. Control Method PID Closed-Loop + SSR Driving
Temp. Control Precision ±1°C
Data Storage Process data and status (80 GB)
Nozzle Plate Aluminum Alloy Plate
Alarm System Abnormal Temp. (Over-temp / Low-temp); Board Drop Alarm
Signal Tower Amber = Warning  |  Green = Normal  |  Red = Abnormal
OS / Interface Windows 7; Chinese & English bilingual
GENERAL
Machine Dimensions (L×W×H) 5,300 × 1,350 × 1,550 mm (Alibaba listing)
Machine Dimensions R8-N 5,620 × 1,445 × 1,520 mm (Made-in-China listing)
Machine Weight ~2,200 kg
Color Computer Grey
Nitrogen Option Available (O2 Analyzer + N2 Pipes included)
Certification CE, ISO 9000, CCC, RoHS
Warranty 1 Year
Place of Origin Shenzhen, Guangdong, China
* Specifications may vary between variants. Please confirm with Jaguar or your authorized distributor for the latest confirmed datasheet.

Applications

The JAGUAR R8 is suited for high-precision, high-volume SMT reflow soldering processes including:

  • High-volume SMT reflow soldering of lead-free (SAC305/SAC387) and tin-lead assemblies
  • BGA, CSP, QFN, LGA, and fine-pitch component soldering requiring precise thermal profiles
  • Mixed-technology PCB assembly (SMT + DIP) production lines
  • Automotive ECU, ADAS sensor modules, and power electronics PCB manufacturing
  • Medical device and aerospace PCB assemblies requiring strict process control and traceability
  • Telecommunications, networking, and 5G infrastructure PCB production
  • LED driver boards, power supplies, and industrial control PCBs
  • High-reliability applications requiring nitrogen atmosphere (N2) soldering


Industries Served

  • Consumer electronics and smart device high-volume manufacturing
  • Automotive electronics (ECUs, ADAS, EV battery management, LED lighting systems)
  • Aerospace & defense high-reliability PCB assemblies
  • Medical devices and life sciences electronics
  • Industrial automation, power electronics, and control systems
  • Telecommunications, networking, and 5G infrastructure
  • LED lighting and display panel production

Why Choose the R8?

vs. Standard / Mid-Range Reflow Ovens vs. Entry-Level 6-Zone Ovens
16 independent heating zones (8T+8B) vs. 6–10 on mid-range machines — finer thermal profile control, superior zone-to-zone isolation, and faster thermal compensation for complex components. Longer 3,121 mm heating passage and more zones means a gentler, better-controlled reflow profile — critical for lead-free SAC alloys, BGA, and high-density mixed SMT assemblies.
vs. Non-Nitrogen Reflow Ovens vs. Batch / Offline Reflow
Optional N2 module reduces oxygen to <1,000 ppm — eliminates oxidation-related defects, improves solder joint brightness, and is essential for fine-pitch, flip-chip, and high-reliability assemblies. Fully inline mesh-and-chain conveyor design enables continuous production flow with no board-to-board delays — seamlessly integrates into any SMT line at standard 900 mm height.
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