AB Epoxy Automatic Potting Machine – SEC-S3030-C
AB Epoxy Automatic Potting Machine – SEC-S3030-C
● Mobel: 1150D
● MOQ : 1 set
● Packing details:
● Subject to discussion:
Couldn't load pickup availability
Product overview
The Automatic 2-Part Materials Mixing and Potting Machine is a high-performance system designed for precise mixing and dispensing of two-component adhesives such as epoxy, silicone, and polyurethane.
It features a user-friendly bilingual touch screen interface (Chinese/English), intelligent control software, and a robust XYZ servo-driven platform for stable and accurate operation.
With advanced metering technology and a dynamic/static mixing system, the machine ensures consistent ratio control (from 100:100 to 100:10), bubble-free potting, and high production efficiency.
Its modular design allows flexible customization for different adhesive types and product dimensions — making it ideal for medium to large-scale encapsulation production.
Technical specifications
| Working Range (X/Y/Z) | 400 × 300 × 100 mm |
|---|---|
| Travel Speed | 0–500 mm/s |
| Mixing Accuracy | ±2% |
| Dispensing Accuracy | ±2% |
| Mixing Ratio | Adjustable 100:100 – 100:10 |
| Dispensing Speed | 1–30 g/s |
| Metering Method | Stepper/Servo Motor with Plunger or Screw Pump |
| Transfer Method | Servo Motor + Ball Screw |
| Working Viscosity | ≤100,000 CPS |
| Power Supply | AC380V / 50Hz / 3.0kW |
| Machine Dimensions | 2350(L) × 1600(W) × 2100(H) mm |
| Machine Weight | Approx. 600–800 kg |
| Operating Environment | Humidity: 20–90%, Temp: 0–40°C |
| Vision System | High-definition CCD camera |
| Control System | Windows-based PC with control software |
| Communication Protocol | SMEMA compatible |
| Air Pressure | 0.65 MPa ± 0.02 MPa, 0.2 m³/h |
Main Components:
- Industrial PC + Monitor (DELL)
- XYZ servo robotic platform
- Dual material tanks (independent storage)
- Dual metering pumps (screw/gear/piston type)
- Static or dynamic mixing valve
- Automatic valve cleaning tank
- Imported vacuum pump
