204 Desoldering Pumps

204 Desoldering Pumps

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EXW China
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● Mobel:  1150D
● MOQ :  1 set
● Packing details:  
● Subject to discussion:

Specifications 

- Metal body
- High suction power
- Ideal for all types of PC board repair work (Recommended For Mini Switches)
- Light weight
- Easy to operate with only one hand
- Simple to clean the cylinde
- Soldering pump, soldering sucker, desoldering guns
 
How to desolder  
The spring loaded plunger is depressed into the desoldering tool cylinder and locked down. The tip of the desoldering tool is placed over molten solder connections while the button is pressed to release the spring loaded plunger. Vacuum d at the tip of the desoldering tool removes the molten solder from the board. The molten solder is captured and cools instantly inside the cylinder of the tool.



Model Case Material Suction Power
201 Plastic 40hg /cm
202 Plastic 40hg /cm
203 Aluminium 28hg /cm
204 Aluminium 30hg /cm
205 Nylon + EVA Foam 32hg /cm

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FAQ

What are the key features of the 204 Desoldering Pump, and how do they enhance its performance?

The 204 Desoldering Pump is designed with features that enhance its effectiveness and user convenience:

High Suction Power: Equipped with a strong spring mechanism or pneumatic system that provides powerful suction. This is essential for quickly and efficiently removing molten solder from PCB pads and components.
Robust Construction: Made from durable materials like metal or high-grade plastic to ensure longevity and resistance to wear from repeated use. This durability helps maintain consistent performance over time.
Ergonomic Design: Features an ergonomic handle and balanced weight, which helps reduce hand fatigue during extended use and improves overall control and comfort.
Easy Maintenance: Designed for easy disassembly and cleaning. This feature helps prevent solder clogs and ensures the pump remains effective and reliable.
These features contribute to the pump’s efficiency, making it suitable for various desoldering tasks.

How should I maintain and clean the 204 Desoldering Pump to ensure it remains in good working condition?

Proper maintenance and cleaning are crucial for the 204 Desoldering Pump to function effectively:

Clean After Use: After each use, allow the pump to cool down, then clean the nozzle and exterior with a soft cloth. Remove any solder residues to prevent blockages.
Disassemble for Thorough Cleaning: Periodically disassemble the pump as per the manufacturer's instructions to clean internal components. Ensure that all parts are dry before reassembling to avoid performance issues.
Inspect for Blockages: Regularly check the nozzle and suction mechanism for any solder buildup or obstructions. Clear any blockages to maintain effective suction.
Check for Wear and Tear: Inspect the pump for signs of wear, especially on the nozzle and spring mechanism. Replace any damaged or worn parts to ensure continued performance.

How do I use the 204 Desoldering Pump effectively for different desoldering tasks?

To use the 204 Desoldering Pump effectively, follow these steps:

Preheat Soldering Iron: Heat your soldering iron to the appropriate temperature to melt the solder. Apply the iron to the solder joint to ensure it is fully melted.
Position the Pump: Once the solder is molten, position the nozzle of the desoldering pump close to the solder joint. Speed is important, as solder can solidify quickly once the heat is removed.
Activate Suction: Press the trigger or button on the pump to create a vacuum. Quickly position the nozzle over the molten solder and release the trigger to suck the solder into the pump.
Repeat as Needed: For thorough desoldering, you may need to repeat the process. Ensure that the nozzle is clean and free from obstructions to achieve the best results.
By following these guidelines, you can effectively use the 204 Desoldering Pump for various desoldering tasks, ensuring efficient and precise removal of solder from electronic components.